Contents

• Syllabus - MEMS and Nanotechnology

   

   

  Unit 1.

   

  Introduction to Nanoelectronics: Top Down and Bottom UP Approach, Nanotechnology Potentials, Idea of band structure – Metals, Insulators and Semiconductors. Effect of crystal size on density of states and band gap, Electronic structure of nanoparticles. Nanostructured crystals, Size and dimensionality effects – Single electron tunneling – Applications – Superconductivity, Graphenes and CNT.

   

  Unit 2.

   

  Nano Fabrication and Patterning Techniques: Si processing methods, Cleaning/etching, Oxidation, Gettering, doping, Epitaxy. CVD & MOCVD, Physical Vapor Deposition (PVD), Liquid Phase Techniques, Self assembly and catalysis. Etching: Wet and Dry, Nanolithography, Nanoimprinting, XRay Lithography(XRL), Particle beam lithography(e-beam, FIB, shadow mask evaporation),

  Unit 3.

   

  General Characterization Techniques: X- Ray Diffraction studies – Bragg’s law – particle size – Scherrer’s equation, Infrared Spectroscopy of Semiconductors, Raman Spectroscopy, Dynamic Light Scattering (DLS), NMR Spectroscopy, ESR Spectroscopy. photo electron spectroscopy(XPS)- SEM,TEM,STM, Atomic force microscopy(AFM).

   

  Unit 4.

   

  Electrical, Magnetic, Mechanical and Optical Properties and Applications: Electronic and electrical properties -One dimensional systems-Metallic nanowires, Quantum dots -Two dimensional systems - Quantum wells. Magnetic properties -Transport in a magnetic field. Mechanical properties, Optical properties, Evolving interfaces of Nano in NanoBiology, Nano Sensors and Nanomedicines

   

  Unit 5.

   

  MEMS and Microsystems: Evolution of Micro Fabrication – Micro Systems and Microelectronics. Application of MEMS in Various Fields. Introduction – Substrate and Wafer, Active Substrate Material. Silicon as a substrate material, MEMS packaging. Case study on pressure sensor with packaging.